IPC作为建立电子组装件生产的标准和指南的领导机构，发布了IPC 7526标准，其中罗列了网板清洗以及误印板清洗的可靠方法。

　　手工清洗后，残留在网板细间距开口中的焊锡膏会造成印刷图形不连续，从而发生桥接和焊点之间的焊球。IPC 7526标准建议使用自动清洗工艺代替SMT网板手工清洗，以达到优化和一致的清洗结果。自动清洗工艺是误印板清洗的主要选择。就手工清洗来说，锡粉会污染整块基板，并对后续工艺的可靠性造成影响。

　　关于自动清洗工艺中使用的清洗剂，使用ZESTRON水基型网板和误印板清洗剂可以完全达到IPC7526标准对技术参数的定义。

　　Reliable stencil and misprint cleaning according to IPC standards

　　IPC, the leading organisation for standards and guidelines within the production of electronic assemblies, published the standard „IPC 7526“, which describes measures for the reliable cleaning of stencils and misprinted assemblies.

　　Solder paste residues, which remain in fine-pitch apertures after manual cleaning, cause inconsistent print images and thus can lead to bridges and solder balling between solder joints. “IPC 7526” therefore recommends automated cleaning processes for SMT stencils instead of manual cleaning to achieve optimal and reproducible cleaning results.

　　An automated process is generally the method of choice for cleaning misprinted assemblies. In the case of manual cleaning solder balls are smeared across the entire assembly, thus influencing its reliability later on.

　　For the use of cleaning media in automated processes, the „IPC 7526“ defines parameters, which can all be met by the water-based stencil and misprint cleaning agents from ZESTRON.

　　如需获取更多信息，请发送邮件至：info@zestron.com 或请访问www.zestron.com